Multipin Feedthroughs

The robust Push-Pull Compact Power Feedthroughs enable the utilization of proven push-pull connectors in high and ultra-high vacuum applications.

Sub-D feedthroughs are available in pin/pin- and socket/pin-design. The most commonly used pin/pin-design is available in three variants for different levels of technical requirements.

Sub-D Power uses the same shell sizes as Sub-D, but with few high current contacts for up to 40 A per contact. Available are 3, 5 and 8 contacts in a pin/pin design. 

Sub-D HD ("high density") uses the same shell sizes as Sub-D, but with a higher contact density. Available are 15, 26, 44, 62, 78 and 104 contacts in a socket/pin-design (pin/pin partially available on request). 

Micro-D feedthroughs provide the highest contact density (up to 100 contacts) with plug connection on both sides for applications down to ultra-high vacuum level.

Multipin Feedthroughs acc. to MIL-DTL-26482 offer a high contact density, small flange sizes and three options for vacuum side cable connection.

Multipin feedthroughs acc. to MIL-DTL-5015 allow high currents with utilization of air side connectors in several shell sizes and numbers of contacts.

Multipin feedthroughs of the category MPC2HV3 enable the transfer of high voltage up to 3 kV with connectors on both sides for up to 32 contacts (41 contacts available on request).

Multipin feedthroughs of the category MPCHV12 enable the transfer of high voltage up to 12 kV with an air side connector for up to 7 contacts.

With USB feedthroughs (2.0 or 3.0, type A), signals and data can be transmitted through the wall of a vacuum system based on USB plug connections.

With VACOM's new and exclusive RJ45 feed-through data can be transmitted in vacuum applications based on RJ45 Ethernet connectors.

Air side and vacuum side plug connectors are used for secure contacting of feedthroughs and must be assembled with suitable cables.